IEC - Página 191/390

• Norma Técnica IEC 61183

  Título: Electroacoustics - Random-incidence and diffuse-field calibration of sound level meters
  Entidade: IEC
  Assunto: Eletroacústica

• Norma Técnica IEC 61184

  Título: Bayonet lampholders
  Entidade: IEC
  Assunto: Tampões e suportes para lâmpadas

• Norma Técnica IEC 61185

  Título: Ferrite cores (ETS-cores) intended for use in power supply applications - Dimensions
  Entidade: IEC
  Assunto: Componentes magnéticos

• Norma Técnica IEC 61186-1

  Título: Transformers and inductors for use in telecommunication and electronic equipment; designations for cores and assemblies; part 1: laminated cores
  Entidade: IEC
  Assunto: Componentes magnéticos

• Norma Técnica IEC 61187

  Título: Electrical and electronic measuring equipment; documentation
  Entidade: IEC
  Assunto: Medição de magnitudes elétricas e magnéticas

• Norma Técnica IEC 61188-1-1

  Título: Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
  Entidade: IEC
  Assunto: Montagem de componentes eletrônicos

• Norma Técnica IEC 61188-1-2

  Título: Printed boards and printed boards assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61188-5-1

  Título: Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations; Generic requirements
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61188-5-2

  Título: Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations; Discrete components
  Entidade: IEC
  Assunto: Montagem de componentes eletrônicos

• Norma Técnica IEC 61188-5-3

  Título: Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61188-5-4

  Título: Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61188-5-5

  Título: Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61188-5-6

  Título: Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides
  Entidade: IEC
  Assunto: Montagem de componentes eletrônicos

• Norma Técnica IEC 61188-5-8

  Título: Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61188-6-1

  Título: Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61188-6-2

  Título: Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61188-6-4

  Título: Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61188-7

  Título: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-1

  Título: Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
  Entidade: IEC
  Assunto: Montagem de componentes eletrônicos

• Norma Técnica IEC 61189-11

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-2

  Título: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
  Entidade: IEC
  Assunto: Montagem de componentes eletrônicos

• Norma Técnica IEC 61189-2-501

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-2-630

  Título: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-2-719

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-2-721

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
  Entidade: IEC
  Assunto: Placas e circuitos impressos

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