IEC - Page 191/390

• Norma Técnica IEC 61183

  Title: Electroacoustics - Random-incidence and diffuse-field calibration of sound level meters
  Entity: IEC
  Subject: Electroacoustics

• Norma Técnica IEC 61184

  Title: Bayonet lampholders
  Entity: IEC
  Subject: Lamp caps and holders

• Norma Técnica IEC 61185

  Title: Ferrite cores (ETS-cores) intended for use in power supply applications - Dimensions
  Entity: IEC
  Subject: Magnetic components

• Norma Técnica IEC 61186-1

  Title: Transformers and inductors for use in telecommunication and electronic equipment; designations for cores and assemblies; part 1: laminated cores
  Entity: IEC
  Subject: Magnetic components

• Norma Técnica IEC 61187

  Title: Electrical and electronic measuring equipment; documentation
  Entity: IEC
  Subject: Measurement of electrical and magnetic quantities

• Norma Técnica IEC 61188-1-1

  Title: Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
  Entity: IEC
  Subject: Electronic component assemblies

• Norma Técnica IEC 61188-1-2

  Title: Printed boards and printed boards assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61188-5-1

  Title: Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations; Generic requirements
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61188-5-2

  Title: Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations; Discrete components
  Entity: IEC
  Subject: Electronic component assemblies

• Norma Técnica IEC 61188-5-3

  Title: Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61188-5-4

  Title: Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61188-5-5

  Title: Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61188-5-6

  Title: Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides
  Entity: IEC
  Subject: Electronic component assemblies

• Norma Técnica IEC 61188-5-8

  Title: Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61188-6-1

  Title: Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61188-6-2

  Title: Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61188-6-4

  Title: Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61188-7

  Title: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61189-1

  Title: Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
  Entity: IEC
  Subject: Electronic component assemblies

• Norma Técnica IEC 61189-11

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61189-2

  Title: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
  Entity: IEC
  Subject: Electronic component assemblies

• Norma Técnica IEC 61189-2-501

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61189-2-630

  Title: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61189-2-719

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61189-2-721

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
  Entity: IEC
  Subject: Printed circuits and boards

• 186
• 187
• 188
• 189
• 190
• 191
• 192
• 193
• 194
• 195
• 196

---

SEARCH

Standard/Regulation code

Search