IEC - Página 192/390

• Norma Técnica IEC 61189-2-807

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-3

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-3-719

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-3-913

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-5

  Título: Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-5-1

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-5-2

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods materials and assemblies - Soldering flux for printed board assemblies
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-5-3

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-5-301

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-5-4

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-5-501

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-5-502

  Título: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-5-503

  Título: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-5-504

  Título: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-5-601

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61189-6

  Título: Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61190-1-1

  Título: Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
  Entidade: IEC
  Assunto: Braseiragem e soldagem

• Norma Técnica IEC 61190-1-2

  Título: Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly
  Entidade: IEC
  Assunto: Braseiragem e soldagem

• Norma Técnica IEC 61190-1-3

  Título: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non- fluxed solid solder for electronic soldering applications
  Entidade: IEC
  Assunto: Braseiragem e soldagem

• Norma Técnica IEC 61191-1

  Título: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61191-2

  Título: Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61191-3

  Título: Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61191-4

  Título: Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61191-6

  Título: Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
  Entidade: IEC
  Assunto: Placas e circuitos impressos

• Norma Técnica IEC 61192-1

  Título: Workmanship requirements for soldered electronic assemblies - Part 1: General
  Entidade: IEC
  Assunto: Braseiragem e soldagem

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