IEC - Page 137/390

• Norma Técnica IEC 60749-19

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-2

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-20

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-20-1

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-21

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-22

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-23

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-24

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-25

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-26

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-27

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-28

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-29

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-3

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-30

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-31

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-32

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-33

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-34

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-35

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-36

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-37

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-38

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 60749-39

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
  Entity: IEC
  Subject: Mechanical structures for electronic equipment

• Norma Técnica IEC 60749-4

  Title: Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
  Entity: IEC
  Subject: Semiconductor devices in general

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