IEC - Page 44/390

• Norma Técnica IEC 60191-6-16

  Title: Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
  Entity: IEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica IEC 60191-6-17

  Title: Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLAGA)
  Entity: IEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica IEC 60191-6-18

  Title: Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
  Entity: IEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica IEC 60191-6-19

  Title: Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
  Entity: IEC
  Subject: Mechanical structures for electronic equipment

• Norma Técnica IEC 60191-6-2

  Title: Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
  Entity: IEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica IEC 60191-6-20

  Title: Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
  Entity: IEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica IEC 60191-6-21

  Title: Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
  Entity: IEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica IEC 60191-6-22

  Title: Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
  Entity: IEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica IEC 60191-6-3

  Title: Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quad flat packs (QFP)
  Entity: IEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica IEC 60191-6-4

  Title: Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
  Entity: IEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica IEC 60191-6-5

  Title: Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA)
  Entity: IEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica IEC 60191-6-6

  Title: Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA)term
  Entity: IEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica IEC 60191-6-8

  Title: Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP)
  Entity: IEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica IEC 60192

  Title: Low pressure sodium vapour lamps - Performance specifications
  Entity: IEC
  Subject: Fluorescent lamps. Discharge lamps

• Norma Técnica IEC 60193

  Title: Hydraulic turbines, storage pumps and pump-turbines - Model acceptance tests
  Entity: IEC
  Subject: Hydraulic energy engineering

• Norma Técnica IEC 60193A

  Title: International code for model acceptance test of hydraulic turbines.
  Entity: IEC
  Subject: Hydraulic energy engineering

• Norma Técnica IEC 60194

  Title: Printed board design, manufacture and assembly - Terms and definitions
  Entity: IEC
  Subject: Electronics (Vocabularies)

• Norma Técnica IEC 60194-1

  Title: Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
  Entity: IEC
  Subject: Electronics (Vocabularies)

• Norma Técnica IEC 60194-2

  Title: Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
  Entity: IEC
  Subject: Electronics (Vocabularies)

• Norma Técnica IEC 60195

  Title: Method of measurement of current noise generated in fixed resistors
  Entity: IEC
  Subject: Fixed resistors

• Norma Técnica IEC 60196

  Title: IEC standard frequencies
  Entity: IEC
  Subject: Electrical engineering in general

• Norma Técnica IEC 60197

  Title: High-voltage connecting wire with flame retarding insulation for use in television receivers
  Entity: IEC
  Subject: Wires

• Norma Técnica IEC 60198

  Title: International code for the field acceptance tests of storage pumps
  Entity: IEC
  Subject: Gas and steam turbines. Steam engines

• Norma Técnica IEC 60201

  Title: Power sources for portable prospecting equipment for radioactive materials
  Entity: IEC
  Subject: Mining and quarrying

• Norma Técnica IEC 60202

  Title: Polyester film dielectric capacitors for direct current
  Entity: IEC
  Subject: Paper and plastic capacitors

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