IEC - Page 43/390

Norma Técnica IEC 60191-2P

Title: Mechanical standardization of semiconductor devices; part 2: dimensions; fourteenth supplement to IEC 191-2:1966
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-2Q

Title: Fifteenth supplement to IEC 191-2 (1966); mechanical standardization of semiconductor devices; part 2: dimensions;
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-2R

Title: Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 16 to IEC 60191-2(1966)
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-2S

Title: Mechanical standardization of semiconductor devices - Part 2: Dimensions; 17. Supplement to IEC 191-2 (1966)
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-2T

Title: Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 18
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-2U

Title: Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 19
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-2V

Title: Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 20
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-2W

Title: Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 21
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-2X

Title: Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 22
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-2Y

Title: Mechanical standardization of semiconductor devices - Part 2: Dimensions (23rd Supplement to Publication 60191-2:1966)
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-2Z

Title: Mechanical standardization of semiconductor devices - Part 2: Dimensions; Supplement 24
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-3

Title: Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
Entity: IEC
Subject: Electrical and electronics engineering drawings
Norma Técnica IEC 60191-3A

Title: Mechanical standardization of semiconductor devices. Part 3 : General rules for the preparation of outline drawings of integrated circuits.
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-3B

Title: Mechanical standardization of semiconductor devices. Part 3 : General rules for the preparation of outline drawings of integrated circuits.
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-3C

Title: Mechanical standardization of semiconductor devices. Part 3 : General rules for the preparation of outline drawings of integrated circuits.
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-3D

Title: Fourth supplement to publication 60191-3-(1974); mechanical standardization of semiconductor devices; part 3: general rules for the preparation of outline drawings of integrated circuits; packages of form G intended for automated handling
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-3E

Title: Mechanical standardization of semiconductor devices; part 3: general rules for the preparation of outline drawings of integrated circuits; pin grid arrays; fifth supplement to IEC 60191-3:1974
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-3F

Title: Mechanical standardization of semiconductor devices; part 3: general rules for the preparation of outline drawings of integrated circuits; supplement 6
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-4

Title: Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Entity: IEC
Subject: Mechanical structures for electronic equipment
Norma Técnica IEC 60191-5

Title: Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
Entity: IEC
Subject: Integrated circuits. Microelectronics
Norma Técnica IEC 60191-6

Title: Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Entity: IEC
Subject: Electrical and electronics engineering drawings
Norma Técnica IEC 60191-6-1

Title: Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals
Entity: IEC
Subject: Electrical and electronics engineering drawings
Norma Técnica IEC 60191-6-10

Title: Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
Entity: IEC
Subject: Electrical and electronics engineering drawings
Norma Técnica IEC 60191-6-12

Title: Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA)
Entity: IEC
Subject: Electrical and electronics engineering drawings
Norma Técnica IEC 60191-6-13

Title: Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
Entity: IEC
Subject: Semiconductor devices in general

IEC - Page 43/390

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