AFNOR - Página 1126/2476

• Norma Técnica NF EN 61188-1-1

  Título: Printed board and printed board assemblies. Design and use. Part 1-1 : generic requirements. Flatness considerations for electronic assemblies.
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61188-1-2

  Título: Printed boards and printed board assemblies - Design and use - Part 1-2 : generic requirements - Controlled impedance
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61188-5-1

  Título: Printed boards and printed board assemblies - Design and use - Part 5-1 : attachment (land/joint) considerations - Generic requirements
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61188-5-2

  Título: Printed boards and printed board assemblies - Design and use - Part 5-2 : attachment (land/joint) considerations - Discrete components
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61188-5-3

  Título: Printed boards and printed board assemblies - Design and use - Part 5-3 : attachment (land/joint) considerations - Components with gull-wing leads on two sides
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61188-5-4

  Título: Printed boards and printed board assemblies - Design and use - Part 5-4 : attachment (land/joint) consideration - Components with J leads on two sides
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61188-5-5

  Título: Printed boards and printed board assemblies - Design and use - Part 5-5 : Attachment (land/joint) considerations - Components with gull-wing leads on four sides
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61188-5-6

  Título: Printed boards and printed board assemblies - Design and use - Part 5-6 : attachment (land/joint) considerations - Chip carriers with J-leads on four sides
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61188-5-8

  Título: Printed boards and printed board assemblies - Design and use - Part 5-8 : Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61188-7

  Título: Printed boards and printed board assemblies - Design and use - Part 7 : electronic component zero orientation for CAD library construction
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61189-1

  Título: Test methods for electrical materials, interconnection structures and assemblies. Part 1 : general test methods and methodology.
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61189-11

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11 : measurement of melting temperature or melting temperature ranges of solder alloys
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61189-2

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2 : test methods for materials for interconnection structures
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61189-2-719

  Título: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61189-2-721

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721 : test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61189-3

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3 : test methods for interconnection structures (printed boards)
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61189-3-719

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719 : test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61189-5

  Título: Test methods for electrical materials, interconnection structures and assemblies - Part 5 : test methods for printed board assemblies
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61189-5-1

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1 : general test methods for materials and assemblies - Guidance for printed board assemblies
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61189-5-2

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2 : general test methods for materials and assemblies - Soldering Flux for printed board assemblies
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61189-5-3

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3 : general test methods for materials and assemblies - Soldering paste for printed board assemblies
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61189-5-4

  Título: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4 : general test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for wire for printed board assembies
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61189-5-503

  Título: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503 : general test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61189-6

  Título: Test methods for electrical materials, interconnection structures and assemblies - Part 6 : test methods for materials used in manufacturing electronic assemblies
  Entidade: AFNOR
  Assunto: Placas e circuitos impressos

• Norma Técnica NF EN 61190-1-1

  Título: Attachment materials for electronic assembly - Part 1-1 : Requirements for soldering fluxes for high-quality interconnections in electronics assembly
  Entidade: AFNOR
  Assunto: Montagem de componentes eletrônicos

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