IEC - Page 325/390

• Norma Técnica IEC/PAS 62170

  Title: Bond wire modeling standard
  Entity: IEC
  Subject: Integrated circuits. Microelectronics

• Norma Técnica IEC/PAS 62171

  Title: Guidelines for particle impact noise detection (PIND) testing, operator training and certification
  Entity: IEC
  Subject: Quality management and quality assurance

• Norma Técnica IEC/PAS 62172

  Title: Accelerated moisture resistance - Unbiased autoclave
  Entity: IEC
  Subject: Electronic component assemblies

• Norma Técnica IEC/PAS 62173

  Title: Solderability test method
  Entity: IEC
  Subject: Brazing and soldering

• Norma Técnica IEC/PAS 62174

  Title: Resistance to soldering temperature for through-hole mounted devices
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC/PAS 62175

  Title: Marking permanency test method
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC/PAS 62177

  Title: Highly-accelerated temperature and humidity stress test (HAST)
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC/PAS 62178

  Title: Temperature cycling
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC/PAS 62179

  Title: Electrostatic discharge (ESD) sensitive testing human body model (HBM)
  Entity: IEC
  Subject: Electrical engineering in general

• Norma Técnica IEC/PAS 62180

  Title: Electrostatic discharge (ESD) sensitive testing machine model (MM)
  Entity: IEC
  Subject: Electrical engineering in general

• Norma Técnica IEC/PAS 62181

  Title: IC latch-up test
  Entity: IEC
  Subject: Integrated circuits. Microelectronics

• Norma Técnica IEC/PAS 62182

  Title: Preconditioning of nonhermetic surface mount devices prior to reliability testing
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC/PAS 62183

  Title: Salt atmosphere
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC/PAS 62184

  Title: Lead integrity test method
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC/PAS 62185

  Title: Thermal shock test method
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC/PAS 62186

  Title: Mechanical shock test method
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC/PAS 62187

  Title: Variable frequency vibration test method
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC/PAS 62189

  Title: Bias life
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC/PAS 62190

  Title: Moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC/PAS 62191

  Title: Acoustic microscopy for nonhermetic encapsulated electronic components
  Entity: IEC
  Subject: Electronic components in general

• Norma Técnica IEC/PAS 62201

  Title: A procedure for executing SWEAT
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC/PAS 62202

  Title: Failure mechanisms and models for silicon semiconductor devices
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC/PAS 62203

  Title: Guide for the standard probe pad sizes and layouts for wafer-level electrical testing
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC/PAS 62204

  Title: Standard method for measuring and using the temperature coefficient of resistance to determine the temperature of a metallization line
  Entity: IEC
  Subject: Integrated circuits. Microelectronics

• Norma Técnica IEC/PAS 62205

  Title: High temperature storage life
  Entity: IEC
  Subject: Electronic components in general

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