BSI - Page 1390/2460

• Norma Técnica BS EN 62044-3

  Title: Cores made of soft magnetic materials. Measuring methods. Magnetic properties at high excitation level
  Entity: BSI
  Subject: Measurement of electrical and magnetic quantities

• Norma Técnica BS EN 62047-1

  Title: Semiconductor devices. Micro-electromechanical devices. Terms and definitions
  Entity: BSI
  Subject: Electronics (Vocabularies)

• Norma Técnica BS EN 62047-10

  Title: Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-11

  Title: Semiconductor devices. Micro-electromechanical devices. Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-12

  Title: Semiconductor devices. Micro-electromechanical devices. Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-13

  Title: Semiconductor devices. Micro-electromechanical devices. Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-14

  Title: Semiconductor devices. Micro-electromechanical devices. Forming limit measuring method of metallic film materials
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-15

  Title: Semiconductor devices. Micro-electromechanical devices. Test method of bonding strength between PDMS and glass
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-16

  Title: Semiconductor devices. Micro-electromechanical devices. Test methods for determining residual stresses of MEMS films Wafer curvature and cantilever beam deflection methods
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-17

  Title: Semiconductor devices. Micro-electromechanical devices. Bulge test method for measuring mechanical properties of thin films
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-18

  Title: Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-19

  Title: Semiconductor devices. Micro-electromechanical devices. Electronic compasses
  Entity: BSI
  Subject: Electromechanical components for electronic and telecommunications equipment in general

• Norma Técnica BS EN 62047-2

  Title: Semiconductor devices - Micro-electromechanical devices - Tensile testing method of thin film materials
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-20

  Title: Semiconductor devices. Micro-electromechanical devices. Gyroscopes
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-21

  Title: Semiconductor devices. Micro-electromechanical devices. Test method for Poisson's ratio of thin film MEMS materials
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-22

  Title: Semiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-25

  Title: Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-26

  Title: Semiconductor devices. Micro-electromechanical devices. Description and measurement methods for micro trench and needle structures
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-3

  Title: Semiconductor devices - Micro-electromechanical devices - Thin film standard test piece for tensile testing
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-4

  Title: Semiconductor devices. Micro-electromechanical devices. Generic specification for MEMS
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-5

  Title: Semiconductor devices. Micro-electromechanical devices. RF MEMS switches
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-6

  Title: Semiconductor devices. Micro-electromechanical devices. Axial fatigue testing methods of thin film materials
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-7

  Title: Semiconductor devices. Micro-electromechanical devices. MEMS BAW filter and duplexer for radio frequency control and selection
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-8

  Title: Semiconductor devices. Micro-electromechanical devices. Strip bending test method for tensile property measurement of thin films
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 62047-9

  Title: Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS
  Entity: BSI
  Subject: Semiconductor devices in general

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