BSI - Page 1302/2460

• Norma Técnica BS EN 60749-14

  Title: Semiconductor devices - Mechanical and climatic test methods - Robustness of terminations (lead integrity)
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-15

  Title: Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-16

  Title: Semiconductor devices - Mechanical and climatic test methods - Particle impact noise detection (PIND)
  Entity: BSI
  Subject: Noise emitted by machines and equipment

• Norma Técnica BS EN 60749-17

  Title: Semiconductor devices - Mechanical and climatic test methods - Neutron irradiation
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-18

  Title: Semiconductor devices - Mechanical and climatic test methods - Ionizing radiation (total dose)
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-19

  Title: Semiconductor devices. Mechanical and climatic test methods. Die shear strength
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-2

  Title: Semiconductor devices - Mechanical and climatic test methods - Low air pressure
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-20

  Title: Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-20-1

  Title: Semiconductor devices - Mechanical and climatic test methods - Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-21

  Title: Semiconductor devices. Mechanical and climatic test methods. Solderability
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-22

  Title: Semiconductor devices - Mechanical and climatic test methods - Bond strength
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-23

  Title: Semiconductor devices. Mechanical and climatic test methods. High temperature operating life
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-24

  Title: Semiconductor devices - Mechanical and climatic test methods - Accelerated moisture resistance - Unbiased HAST
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-25

  Title: Semiconductor devices - Mechanical and climatic test methods - Temperature cycling
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-26

  Title: Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-27

  Title: Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-28

  Title: Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). Device level
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-29

  Title: Semiconductor devices. Mechanical and climatic test methods. Latch-up test
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-3

  Title: Semiconductor devices. Mechanical and climatic test methods. External visual examination
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-30

  Title: Semiconductor devices. Mechanical and climatic test methods. Preconditioning of non-hermetic surface mount devices prior to reliability testing
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-31

  Title: Semiconductor devices - Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (internally induced)
  Entity: BSI
  Subject: Ignitability and burning behaviour of materials and products

• Norma Técnica BS EN 60749-32

  Title: Semiconductor devices. Mechanical and climatic test methods. Flammability of plastic-encapsulated devices (externally induced)
  Entity: BSI
  Subject: Ignitability and burning behaviour of materials and products

• Norma Técnica BS EN 60749-33

  Title: Semiconductor devices - Mechanical and climatic test methods - Accelerated moisture resistance - Unbiased autoclave
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-34

  Title: Semiconductor devices. Mechanical and climatic test methods. Power cycling
  Entity: BSI
  Subject: Semiconductor devices in general

• Norma Técnica BS EN 60749-35

  Title: Semiconductor devices - Mechanical and climatic test methods - Acoustic microscopy for plastic encapsulated electronic components
  Entity: BSI
  Subject: Semiconductor devices in general

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