IEC - Page 255/390

• Norma Técnica IEC 62047-15

  Title: Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-16

  Title: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-17

  Title: Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-18

  Title: Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-19

  Title: Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
  Entity: IEC
  Subject: Other semiconductor devices

• Norma Técnica IEC 62047-2

  Title: Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-20

  Title: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-21

  Title: Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-22

  Title: Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-25

  Title: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-26

  Title: Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-27

  Title: Semiconductor devices - Micro-electromechanical devices Part 27: Bond strength test for glass frit bonded structures using micro-chevron- tests (MCT)
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-28

  Title: Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-29

  Title: Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin films under room temperature
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-3

  Title: Semiconductor devices - Micro electromechanical devices - Part 3: Thin film standard test piece for tensile-testing
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-30

  Title: Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-31

  Title: Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
  Entity: IEC
  Subject: Other semiconductor devices

• Norma Técnica IEC 62047-32

  Title: Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-33

  Title: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
  Entity: IEC
  Subject: Other semiconductor devices

• Norma Técnica IEC 62047-34

  Title: Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
  Entity: IEC
  Subject: Other semiconductor devices

• Norma Técnica IEC 62047-35

  Title: Semiconductor devices - Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electromechanical devices
  Entity: IEC
  Subject: Other semiconductor devices

• Norma Técnica IEC 62047-36

  Title: Semiconductor devices - Micro-electromechanical devices - Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
  Entity: IEC
  Subject: Other semiconductor devices

• Norma Técnica IEC 62047-37

  Title: Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
  Entity: IEC
  Subject: Semiconductor devices in general

• Norma Técnica IEC 62047-38

  Title: Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
  Entity: IEC
  Subject: Other semiconductor devices

• Norma Técnica IEC 62047-4

  Title: Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specifications for MEMS
  Entity: IEC
  Subject: Semiconductor devices in general

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