IEC - Page 202/390

• Norma Técnica IEC 61249-2-8

  Title: Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad; Modified brominated epoxide woven fiberglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-2-9

  Title: Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials clad and unclad; Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-3-3

  Title: Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-3-4

  Title: Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-3-5

  Title: Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-4-1

  Title: Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-4-11

  Title: Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide woven E-glass prepreg of defined flammability
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-4-12

  Title: Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-4-14

  Title: Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-4-15

  Title: Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-4-16

  Title: Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-4-17

  Title: Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-4-18

  Title: Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-4-19

  Title: Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non- halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-4-2

  Title: Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-4-5

  Title: Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-5-1

  Title: Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-5-4

  Title: Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-7-1

  Title: Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-8-7

  Title: Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61249-8-8

  Title: Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
  Entity: IEC
  Subject: Printed circuits and boards

• Norma Técnica IEC 61250

  Title: Nuclear reactors; instrumentation and control systems important for safety; detection of leakage in coolant systems
  Entity: IEC
  Subject: Nuclear power plants. Safety

• Norma Técnica IEC 61251

  Title: Electrical insulating materials and systems - AC voltage endurance evaluation
  Entity: IEC
  Subject: Other standards related to electricity and magnetism

• Norma Técnica IEC 61252

  Title: Electroacoustics; specifications for personal sound exposure meters
  Entity: IEC
  Subject: Electroacoustics

• Norma Técnica IEC 61253-1

  Title: Piezoelectric ceramic resonators; a specification in the IEC quality assessment system for electronic components (IECQ); part 1: generic specification; qualification approval
  Entity: IEC
  Subject: Piezoelectric devices

• 197
• 198
• 199
• 200
• 201
• 202
• 203
• 204
• 205
• 206
• 207

---

SEARCH

Standard/Regulation code

Search