CEN CENELEC - Page 901/1255

• Norma Técnica EN IEC 61169-67

  Title: Radio frequency connectors - Part 67: Sectional specification for series TRL threaded triaxial connectors (IEC 61169-67:2022)
  Entity: CEN CENELEC
  Subject: R.F. connectors

• Norma Técnica EN IEC 61169-68

  Title: Radio-frequency connectors - Part 68: Sectional specification for series TRK bayonet coupling triaxial connectors (IEC 61169-68:2022)
  Entity: CEN CENELEC
  Subject: R.F. connectors

• Norma Técnica EN IEC 61169-71

  Title: Radio-frequency connectors - Part 71: Sectional specification for RF coaxial connectors with inner diameter of outer conductor 5 mm - Characteristic impedance 50 Ohms - type NEX10® (IEC 61169-71:2022)
  Entity: CEN CENELEC
  Subject: R.F. connectors

• Norma Técnica EN IEC 61188-6-1

  Title: Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN IEC 61188-6-2

  Title: Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN IEC 61189-2-501

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN IEC 61189-2-630

  Title: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (IEC 61189-2-630:2018)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN IEC 61189-2-807

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (IEC 61189-2-807:2021)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN IEC 61189-5-301

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (IEC 61189-5-301:2021)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN IEC 61189-5-501

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (IEC 61189-5-501:2021)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN IEC 61189-5-502

  Title: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (IEC 61189-5-502:2021)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN IEC 61189-5-504

  Title: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (IEC 61189-5-504:2020)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN IEC 61189-5-601

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 61189-5-601:2021)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN IEC 61190-1-3

  Title: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017)
  Entity: CEN CENELEC
  Subject: Electronic component assemblies

• Norma Técnica EN IEC 61191-1

  Title: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN IEC 61204-3

  Title: Low-voltage switch mode power supplies - Part 3: Electromagnetic compatibility (EMC) (IEC 61204-3:2016)
  Entity: CEN CENELEC
  Subject: Rectifiers. Converters. Stabilized power supply

• Norma Técnica EN IEC 61204-7

  Title: Low-voltage switch mode power supplies - Part 7: Safety requirements (IEC 61204-7:2016)
  Entity: CEN CENELEC
  Subject: Rectifiers. Converters. Stabilized power supply

• Norma Técnica EN IEC 61207-2

  Title: Expression of performance of gas analyzers - Part 2: Measuring oxygen in gas utilizing high-temperature electrochemical sensors (IEC 61207-2:2019)
  Entity: CEN CENELEC
  Subject: Chemical analysis

• Norma Técnica EN IEC 61207-3

  Title: Gas Analyzers - Expression of performance - Part 3: Paramagnetic oxygen analysers (IEC 61207-3:2019)
  Entity: CEN CENELEC
  Subject: Environmental testing

• Norma Técnica EN IEC 61215-1

  Title: Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1: Test requirements (IEC 61215-1:2021)
  Entity: CEN CENELEC
  Subject: Solar energy engineering

• Norma Técnica EN IEC 61215-1-1

  Title: Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1-1: Special requirements for testing of crystalline silicon photovoltaic (PV) modules (IEC 61215-1-1:2021)
  Entity: CEN CENELEC
  Subject: Solar energy engineering

• Norma Técnica EN IEC 61215-1-2

  Title: Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1-2: Special requirements for testing of thin-film Cadmium Telluride (CdTe) based photovoltaic (PV) modules (IEC 61215-1-2:2021)
  Entity: CEN CENELEC
  Subject: Solar energy engineering

• Norma Técnica EN IEC 61215-1-3

  Title: Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1-3: Special requirements for testing of thin- film amorphous silicon based photovoltaic (PV) modules (IEC 61215-1-3:2021)
  Entity: CEN CENELEC
  Subject: Solar energy engineering

• Norma Técnica EN IEC 61215-1-4

  Title: Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1-4: Special requirements for testing of thin- film Cu(In,GA)(S,Se)2 based photovoltaic (PV) modules (IEC 61215-1-4:2021)
  Entity: CEN CENELEC
  Subject: Solar energy engineering

• Norma Técnica EN IEC 61215-2

  Title: Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 2: Test procedures (IEC 61215-2:2021)
  Entity: CEN CENELEC
  Subject: Solar energy engineering

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