CEN CENELEC - Page 765/1255

• Norma Técnica EN 61188-5-3

  Title: Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides (IEC 61188-5-3:2007)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61188-5-4

  Title: Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61188-5-5

  Title: Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 61188-5-5:2007)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61188-5-6

  Title: Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides (IEC 61188-5-6:2003)
  Entity: CEN CENELEC
  Subject: Electronic component assemblies

• Norma Técnica EN 61188-5-8

  Title: Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61188-6-4

  Title: Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61188-7

  Title: Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61189-1

  Title: Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 61189-1:1997)
  Entity: CEN CENELEC
  Subject: Electronic component assemblies

• Norma Técnica EN 61189-11

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61189-2

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61189-2-719

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-719:2016)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61189-2-721

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 61189-2-721:2015)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61189-3

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61189-3-719

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61189-5

  Title: Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61189-5-1

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61189-5-2

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61189-5-3

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61189-5-4

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61189-5-503

  Title: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61189-6

  Title: Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies (IEC 61189-6:2006)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• Norma Técnica EN 61190-1-1

  Title: Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002)
  Entity: CEN CENELEC
  Subject: Brazing and soldering

• Norma Técnica EN 61190-1-2

  Title: Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014)
  Entity: CEN CENELEC
  Subject: Brazing and soldering

• Norma Técnica EN 61190-1-3

  Title: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007)
  Entity: CEN CENELEC
  Subject: Brazing and soldering

• Norma Técnica EN 61191-1

  Title: Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013)
  Entity: CEN CENELEC
  Subject: Printed circuits and boards

• 760
• 761
• 762
• 763
• 764
• 765
• 766
• 767
• 768
• 769
• 770

---

SEARCH

Standard/Regulation code

Search