CEN CENELEC - Page 672/1255

• Norma Técnica EN 60168

  Title: Tests on indoor and outdoor post insulators of ceramic material or glass for systems with nominal voltages greater than 1000 V (IEC 60168:1994)
  Entity: CEN CENELEC
  Subject: Insulators

• Norma Técnica EN 60169-21

  Title: Radio-frequency connectors - Part 21: Two types of radio-frequency connectors with inner diameter of outer conductor 9,5 mm (O,374 in) with different versions of screw coupling - Characteristic impendance 50 ohms (Types SC-A and SC-B) (IEC 60169-21:1985 + A1:1996)
  Entity: CEN CENELEC
  Subject: R.F. connectors

• Norma Técnica EN 60169-23

  Title: Radio-frequency connectors; part 23: pin and socket connector for use with 3,5 mm rigid precision coaxial lines with inner diameter of outer conductor 3,5 mm (0,1378 in) (IEC 60169-23:1991)
  Entity: CEN CENELEC
  Subject: R.F. connectors

• Norma Técnica EN 60169-24

  Title: Radio-frequency connectors; part 24: radio-frequency coxial connectors with screw coupling, typically for use in 75 ohm cable distribution systems (type F) (IEC 60169-24:1991)
  Entity: CEN CENELEC
  Subject: R.F. connectors

• Norma Técnica EN 60169-25

  Title: Radio-frequency connectors; part 25: two-pole screw (3/4-20 UNEF) coupled connectors for use with shielded balanced cables having twin inner conductors with inner diameter of outer conductor 13,56 mm (0,534 in) (type TWHN) (IEC 60169-25:1992)
  Entity: CEN CENELEC
  Subject: R.F. connectors

• Norma Técnica EN 60172

  Title: Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires (IEC 60172:2015)
  Entity: CEN CENELEC
  Subject: Wires

• Norma Técnica EN 6018

  Title: Aerospace series - Test methods for metallic materials - Determination of density according to displacement method
  Entity: CEN CENELEC
  Subject: Materials for aerospace construction in general

• Norma Técnica EN 60182-2

  Title: Basic dimensions of winding wires; part 2: maximum overall diameters of enamelled round winding wires (IEC 60182-2:1987, modified)
  Entity: CEN CENELEC
  Subject: Wires

• Norma Técnica EN 60188

  Title: High pressure mercury vapour lamps - Performance specifications (IEC 60188:2001)
  Entity: CEN CENELEC
  Subject: Fluorescent lamps. Discharge lamps

• Norma Técnica EN 60191-1

  Title: Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2007)
  Entity: CEN CENELEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica EN 60191-3

  Title: Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999)
  Entity: CEN CENELEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica EN 60191-4

  Title: Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013)
  Entity: CEN CENELEC
  Subject: Mechanical structures for electronic equipment

• Norma Técnica EN 60191-6

  Title: Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009)
  Entity: CEN CENELEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica EN 60191-6-1

  Title: Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001)
  Entity: CEN CENELEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica EN 60191-6-10

  Title: Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; General rules for the dimensions of P-VSON (IEC 60191-6-10:2003)
  Entity: CEN CENELEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica EN 60191-6-12

  Title: Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011)
  Entity: CEN CENELEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica EN 60191-6-13

  Title: Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine- pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016)
  Entity: CEN CENELEC
  Subject: Mechanical structures for electronic equipment

• Norma Técnica EN 60191-6-16

  Title: Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007)
  Entity: CEN CENELEC
  Subject: Semiconductor devices in general

• Norma Técnica EN 60191-6-17

  Title: IEC 60191-6-17, Ed. 1: Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLAGA) (IEC 60191-6-17:2011)
  Entity: CEN CENELEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica EN 60191-6-18

  Title: Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010)
  Entity: CEN CENELEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica EN 60191-6-19

  Title: Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage (IEC 6191-6-19:2010)
  Entity: CEN CENELEC
  Subject: Mechanical structures for electronic equipment

• Norma Técnica EN 60191-6-2

  Title: Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-2-6:2001)
  Entity: CEN CENELEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica EN 60191-6-20

  Title: Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010)
  Entity: CEN CENELEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica EN 60191-6-21

  Title: Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010)
  Entity: CEN CENELEC
  Subject: Electrical and electronics engineering drawings

• Norma Técnica EN 60191-6-22

  Title: Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012)
  Entity: CEN CENELEC
  Subject: Electrical and electronics engineering drawings

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