BSI - Page 1474/2460

• Norma Técnica BS EN IEC 61169-71

  Title: Radio-frequency connectors. Sectional specification for RF coaxial connectors with inner diameter of outer conductor 5 mm. Characteristic impedance 50 Ohms. type NEX10®
  Entity: BSI
  Subject: R.F. connectors

• Norma Técnica BS EN IEC 61188-6-1

  Title: Circuit boards and circuit board assemblies. Design and use. Land pattern design. Generic requirements for land pattern on circuit boards
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN IEC 61188-6-2

  Title: Circuit boards and circuit board assemblies. Design and use. Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN IEC 61188-6-4

  Title: Printed boards and printed board assemblies. Design and use. Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN IEC 61189-2-501

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN IEC 61189-2-630

  Title: Test methods for electrical materials, printed board and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN IEC 61189-2-807

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN IEC 61189-5-301

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste using fine solder particles
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN IEC 61189-5-501

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of solder fluxes
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN IEC 61189-5-502

  Title: Test methods for electrical materials, printed board and other interconnection structures and assemblies. General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN IEC 61189-5-503

  Title: Test methods for electrical materials, printed board and other interconnection structures and assemblies. General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN IEC 61189-5-504

  Title: Test methods for electrical materials, printed board and other interconnection structures and assemblies. General test methods for materials and assemblies. Process ionic contamination testing (PICT)
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN IEC 61189-5-601

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN IEC 61190-1-3

  Title: Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
  Entity: BSI
  Subject: Electronic component assemblies

• Norma Técnica BS EN IEC 61191-1

  Title: Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN IEC 61204-3

  Title: Low-voltage switch mode power supplies. Electromagnetic compatibility (EMC)
  Entity: BSI
  Subject: Rectifiers. Converters. Stabilized power supply

• Norma Técnica BS EN IEC 61204-7

  Title: Low-voltage switch mode power supplies. Safety requirements
  Entity: BSI
  Subject: Rectifiers. Converters. Stabilized power supply

• Norma Técnica BS EN IEC 61207-2

  Title: Expression of performance of gas analyzers. Measuring oxygen in gas utilizing high-temperature electrochemical sensors
  Entity: BSI
  Subject: Chemical analysis

• Norma Técnica BS EN IEC 61207-3

  Title: Gas Analyzers. Expression of performance. Paramagnetic oxygen analysers
  Entity: BSI
  Subject: Chemical analysis

• Norma Técnica BS EN IEC 61215-1

  Title: Terrestrial photovoltaic (PV) modules. Design qualification and type approval. Test requirements
  Entity: BSI
  Subject: Solar energy engineering

• Norma Técnica BS EN IEC 61215-1-1

  Title: Terrestrial photovoltaic (PV) modules. Design qualification and type approval. Special requirements for testing of crystalline silicon photovoltaic (PV) modules
  Entity: BSI
  Subject: Solar energy engineering

• Norma Técnica BS EN IEC 61215-1-2

  Title: Terrestrial photovoltaic (PV) modules. Design qualification and type approval. Special requirements for testing of thin-film Cadmium Telluride (CdTe) based photovoltaic (PV) modules
  Entity: BSI
  Subject: Solar energy engineering

• Norma Técnica BS EN IEC 61215-1-3

  Title: Terrestrial photovoltaic (PV) modules. Design qualification and type approval. Special requirements for testing of thin-film amorphous silicon based photovoltaic (PV) modules
  Entity: BSI
  Subject: Solar energy engineering

• Norma Técnica BS EN IEC 61215-1-4

  Title: Terrestrial photovoltaic (PV) modules. Design qualification and type approval. Special requirements for testing of thin-film Cu(In,GA)(S,Se)2 based photovoltaic (PV) modules
  Entity: BSI
  Subject: Solar energy engineering

• Norma Técnica BS EN IEC 61215-2

  Title: Terrestrial photovoltaic (PV) modules. Design qualification and type approval. Test procedures
  Entity: BSI
  Subject: Solar energy engineering

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