BSI - Page 1341/2460

• Norma Técnica BS EN 61189-2-719

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz)
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN 61189-2-721

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
  Entity: BSI
  Subject: Electronic component assemblies

• Norma Técnica BS EN 61189-3

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards)
  Entity: BSI
  Subject: Electronic component assemblies

• Norma Técnica BS EN 61189-3-719

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN 61189-5

  Title: Test methods for electrical materials, interconnection structures and assemblies - Test methods for printed board assemblies
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN 61189-5-1

  Title: Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN 61189-6

  Title: Test methods for electrical materials, interconnection structures and assemblies - Test methods for materials used in manufacturing electronic assemblies
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN 61190-1-1

  Title: Attachment materials for electronic assembly - Requirements for soldering fluxes for high-quality interconnections in electronics assembly
  Entity: BSI
  Subject: Brazing and soldering

• Norma Técnica BS EN 61190-1-2

  Title: Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
  Entity: BSI
  Subject: Brazing and soldering

• Norma Técnica BS EN 61190-1-3

  Title: Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
  Entity: BSI
  Subject: Brazing and soldering

• Norma Técnica BS EN 61191-1

  Title: Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN 61191-2

  Title: Printed board assemblies. Sectional specification. Requirements for surface mount soldered assemblies
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN 61191-3

  Title: Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN 61191-4

  Title: Printed board assemblies. Sectional specification. Requirements for terminal soldered assemblies
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN 61191-6

  Title: Printed board assemblies. Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN 61192-1

  Title: Workmanship requirements for soldered electronic assemblies - General
  Entity: BSI
  Subject: Electronic component assemblies

• Norma Técnica BS EN 61192-2

  Title: Workmanship requirements for soldered electronic assemblies - Surface-mount assemblies
  Entity: BSI
  Subject: Electronic component assemblies

• Norma Técnica BS EN 61192-3

  Title: Workmanship requirements for soldered electronic assemblies - Through-hole mount assemblies
  Entity: BSI
  Subject: Electronic component assemblies

• Norma Técnica BS EN 61192-4

  Title: Workmanship requirements for soldered electronic assemblies - Terminal assemblies
  Entity: BSI
  Subject: Electronic component assemblies

• Norma Técnica BS EN 61192-5

  Title: Workmanship requirements for soldered electric assemblies - Rework, modification and repair of soldered electronic assemblies
  Entity: BSI
  Subject: Electronic component assemblies

• Norma Técnica BS EN 61193-1

  Title: Quality assessment systems - Registration and analysis of defects on printed board assemblies
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN 61193-2

  Title: Quality assessment systems - Selection and use of sampling plans for inspection of electronic components and packages
  Entity: BSI
  Subject: Electrical engineering in general

• Norma Técnica BS EN 61193-3

  Title: Quality assessment systems. Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
  Entity: BSI
  Subject: Printed circuits and boards

• Norma Técnica BS EN 61194

  Title: Characteristic parameters of stand-alone photovoltaic (PV) systems
  Entity: BSI
  Subject: Solar energy engineering

• Norma Técnica BS EN 61195

  Title: Double-capped fluorescent lamps - Safety specifications
  Entity: BSI
  Subject: Fluorescent lamps. Discharge lamps

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