BSI - Page 1251/2460

• Norma Técnica BS EN 60154-4

  Title: Flanges for waveguides. Relevant specifications for flanges for circular waveguides
  Entity: BSI
  Subject: Coaxial cables. Waveguides

• Norma Técnica BS EN 60155

  Title: Glow-starters for fluorescent lamps
  Entity: BSI
  Subject: Other standards relating to lamps

• Norma Técnica BS EN 60156

  Title: Insulating liquids. Determination of the breakdown voltage at power frequency. Test method
  Entity: BSI
  Subject: Insulating oils

• Norma Técnica BS EN 60168

  Title: Tests on indoor and outdoor post insulators of ceramic material or glass for systems with nominal voltages greater than 1000V
  Entity: BSI
  Subject: Insulators

• Norma Técnica BS EN 60169-21

  Title: Radio-frequency connectors. Two types of radio-frequency connectors with inner diameter of outer conductor 9,5 mm (0,374 in) with different versions of screw coupling. Characteristic impedance 50 ohms (types SC-A and SC-B)
  Entity: BSI
  Subject: R.F. connectors

• Norma Técnica BS EN 60169-23

  Title: Radio-frequency connectors. Pin and socket connector for use with 3,5 mm rigid precision coaxial lines with inner diameter of outer conductor 3,5 mm (0,1378 in)
  Entity: BSI
  Subject: R.F. connectors

• Norma Técnica BS EN 60169-24

  Title: Radio-frequency connectors. Radio-frequency coaxial connectors with screw coupling, typically for use in 75 ohm cable distribution systems (Type F)
  Entity: BSI
  Subject: R.F. connectors

• Norma Técnica BS EN 60169-25

  Title: Radio-frequency connectors. Two-pole screw (3/4-20 UNEF) coupled connectors for use with shielded balanced cables having twin inner conductors with inner diameter of outer conductor 13,56 mm (0,534 in) (Type TWHN)
  Entity: BSI
  Subject: R.F. connectors

• Norma Técnica BS EN 60172

  Title: Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires
  Entity: BSI
  Subject: Wires

• Norma Técnica BS EN 6018

  Title: Aerospace series. Test methods for metallic materials. Determination of density according to displacement method
  Entity: BSI
  Subject: Materials for aerospace construction in general

• Norma Técnica BS EN 60182-2

  Title: Basic dimensions of winding wires. Specification for maximum overall diameters of enamelled round winding wires
  Entity: BSI
  Subject: Wires

• Norma Técnica BS EN 60188

  Title: High-pressure mercury vapour lamps - Performance specifications
  Entity: BSI
  Subject: Fluorescent lamps. Discharge lamps

• Norma Técnica BS EN 60191-3

  Title: Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of integrated circuits
  Entity: BSI
  Subject: Electrical and electronics engineering drawings

• Norma Técnica BS EN 60191-4

  Title: Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages
  Entity: BSI
  Subject: Mechanical structures for electronic equipment

• Norma Técnica BS EN 60191-6

  Title: Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages
  Entity: BSI
  Subject: Electrical and electronics engineering drawings

• Norma Técnica BS EN 60191-6-1

  Title: Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
  Entity: BSI
  Subject: Electrical and electronics engineering drawings

• Norma Técnica BS EN 60191-6-10

  Title: Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
  Entity: BSI
  Subject: Electrical and electronics engineering drawings

• Norma Técnica BS EN 60191-6-12

  Title: Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
  Entity: BSI
  Subject: Electrical and electronics engineering drawings

• Norma Técnica BS EN 60191-6-13

  Title: Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
  Entity: BSI
  Subject: Mechanical structures for electronic equipment

• Norma Técnica BS EN 60191-6-16

  Title: Mechanical standardization of semiconductor devices - Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
  Entity: BSI
  Subject: Mechanical structures for electronic equipment

• Norma Técnica BS EN 60191-6-17

  Title: Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
  Entity: BSI
  Subject: Electrical and electronics engineering drawings

• Norma Técnica BS EN 60191-6-18

  Title: Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
  Entity: BSI
  Subject: Electrical and electronics engineering drawings

• Norma Técnica BS EN 60191-6-19

  Title: Mechanical standardization of semiconductor devices. Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
  Entity: BSI
  Subject: Mechanical structures for electronic equipment

• Norma Técnica BS EN 60191-6-2

  Title: Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
  Entity: BSI
  Subject: Electrical and electronics engineering drawings

• Norma Técnica BS EN 60191-6-20

  Title: Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
  Entity: BSI
  Subject: Electrical and electronics engineering drawings

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